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MIRTEC MV-2HTX Automated Optical Inspection (AOI) Systems Print E-mail

MIRTEC MV-2HTX AOI System 

SenDEC's MRTEC MV-2HTX AOI Systems are designed to automatically inspect for manufacturing defects both pre and post reflow.  These systems offer superior fault coverage and can automatically inspect circuit boards optically in seconds for component presence/absence, polarity, value, misalignment, insufficient solder, solder bridging, etc.

 

Features/Constraints:

PCB Size

  • 10 x 41mm (0.41" x 1.6") Min.
  • 530 x 460mm (20.8" x 18.1") Max.

Top Side Component Clearance

  • 45mm (1.77")

Bottom Side component Clearance

  • 50.8mm (2.0") from bottom of PWB surface

Minimum Component Absence/Presence

  • 01005 chip component

Minimum Component Optical Character Recognition (OCR) Inspection

  • 0603 chip component

Inspection Speed

  • 0.16 sec/ frame

Fiducial Mark Recognition Time

  • 1.5 sec/ 2 point

Positioning System

  • 2 Phase Micro Stepper

Resolution

  • 6 μm

Repeatability

  • ± 15 μm

Maximum Speed

  • 700mm/sec
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"I've been in the Purchasing field for many years. During that time I've worked with many good suppliers, but SenDEC is the best I have ever worked with. I have never met a better bunch of people that are dedicated, hardworking, and always go the extra mile for their customers. When other contract manufacturers call me and try to win my business, I tell them up front what they're up against. SenDEC basically spoils us with their quality work, caring service and dedication to their customers."

Maryann J. Denhoff
Materials Manager, InfiMed, Inc.

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