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Machine Capabilities & Features

Board sizes: Minimum:
 50mm x 50mm (2.0” x 2.0”)
Maximum: 380mm x 300mm ( 15.0” x 12.0”)
Board Thickness: Minimum:
 .3mm ( .01”)
Maximum: 3.5mm (.157”) – can be thicker with tooling
Edge Clearance: 5mm (parts should be a min of 10mm from boards edge to ensure no damage occurs)
Placement Accuracy: +/- 0.05mm Cpk >= 1 (.0019”)
Placement Speed: .03 seconds/chip (30,000 components per hour)
Board Exchange Time: Operator dependant (Manual Exchange)
Component Range: Minimum: 0201
Maximum: 56mm x 56mm x 15mm
Component Types: 0201 and greater (chip-type)
SOICs
PLCCs
QFPs Minimum Lead Width = .05mm (.002”), Minimum Lead Pitch = .10mm (.004”)
BGAs & CSPs Minimum Bump Diameter = .08mm (.003”), Minimum Pitch  = .16mm ( .006”)
Placement Angles: 0-359° in .01° increments
Supply Types: Tape from 8mm wide to 32mm wide
Number of feeders accepted: All limits are at initial startup. Additional magazines can be inserted on-the-fly as originals are depleted.
8mm Maximum 64 inputs
12/16mm Maximum 32 inputs
24/32mm
 Maximum 1 input
Board Fiducial Recognition
Removable Magazines: Feeders can be setup off line and loaded on the magazines to reduce change over time











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Perspectives

"The quality and workmanship is exceptional. SenDEC engineers suggested alternative manufacturing methods that have helped us reduce the cost of our printed circuit boards. SenDEC's customer service is extremely cooperative and responsive. Even when we 'need it yesterday', SenDEC bends over backwards to deliver in time."

Jim Childs
Purchasing Agent, Pulsafeeder, Inc.

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