The Revolution is the easiest to use, most cost effective, high quality inspection system on the market. The Revolution provides the highest resolution and magnification possible within a compact system and is designed specifically for use on production lines and in failure analysis laboratories. Intuitive software allows operators to visualize the most demanding defects. The system is designed for 100% BGA and µBGA inspection, multilayer board inspection and PCB solder joint inspection.

Typical Applications

Advanced automatic inspection of:

• Electronic components
• PWB/PCB inspection
• Foreign object and particulate matter identification
• High speed pass / fail analysis of BGA components

Manual inspection of:

• Electronic components
• PWB / PCB inspection
• F.A. applications
• Production verification
• Production line setup
• Batch inspection (high volume production)

Features:

• NanoTech Transmission X-Ray Source
• 160kV Integrated X-Ray Tube
• 11lbs capacity 5-axis fully programmable manipulator
• 360 degrees continuous rotation
• Maximum scan area 16" x 16" (400mm x 400mm)
• Geometric Magnification up to: 2400x
• System Magnification up to: 6000x

Maximum magnification - 6000x

The transmission target design fitted to the Revolution’s X-ray source has an ultra thin output window that enables samples to be safely placed within 250 microns of the focal spot providing up to 6000x system magnification.

High Resolution - Micron Level Features

A tightly controlled microfocus x-ray spot and the latest digital imaging technology ensure that the Revolution produces sharp images of micron level features even in the most challenging samples. The advanced electromagnetic lens is computer controlled to ensure that the image remains in focus at all kV settings and the target does not burn when using high power.

High Penetration - 160kV

The patented X-Tek Xi "Open Tube" x-ray source is smaller than any other design and allows x-ray images of fine detail in thick and dense samples to be seen with ease. This high energy vacuum de-mountable unit allows views at steep angles through solder joints and heatsinks without ever running out of energy.

True Concentric Imaging

The operator chooses a region of interest (ROI) to inspect and positions it in the center of the screen. Under any combination of rotate, tilt and magnification, the ROI remains completely locked into the centre of the field of view. The true concentric imaging feature operates over the entire scan area of the manipulator. The ROI stays locked in, regardless of the sample’s position on the manipulator table, ideal for inspecting around single or multiple BGA balls.

True Parallel Tracking for BGA Applications

A combination of tilt and rotate is required to give the best unobstructed view of BGA balls. The next step is to scan along the rows to inspect for failures. With standard manipulators, this necessitates the simultaneous operation of 3 axes - requiring considerable skill on behalf of the operator. X-Tek's true parallel tracking maintains the X and Y axes parallel to the BGA, allowing the rows to be scanned using a single X or Y axis. This feature is enabled as part of the advanced system control concept.

Advanced Computed Tomography Support 

CT is a non-destructive X-ray inspection technique that produces high-resolution 3D maps of samples. After reconstruction the sample can be viewed from any 3D angle, sliced in any direction, accurately measured and even animated in a virtual workspace. This enables detailed analysis of the internal structure of a wide range of components. The CT extension to X-Tek's real time inspection systems enables complex 3D analysis of the structure of components enabling us to:

• Verify complex internal structures
• Isolate and inspect included components
• Measure dimensions and angles within the sample without sectioning it
• Automatically detect and measure internal voids / volumes
• Remove / strip external surfaces from view to ease inspection