The Onyx 29 semi-automated selective soldering machine developed by Zevac AG of Solothurn/Switzerland not only provides high-performance rework of standard SMD components but also handles problem components. This high-performance machine for selective soldering and desoldering of SMD components provides the user the highest placement precision with components down to 01005 size, Flip Chips, µBGA, CSP, BGA, LGA, MLF, CCGA, TCP, QFP, Fine Pitch, plug and base, RF-shields. It also has plenty in reserve for problem and non standard components.

Features  

Selective Soldering and De-soldering system

• Distributed I/O-, motion and vision control system
• Digital FireWire beam splitting color vision system
• VisualMachines™ process control software with interactive soldering
• Manual to semi-automated operation
• Selective hot gas soldering and de-soldering (air or nitrogen)
• Fully automated site solder cleaning

Distributed control system

• Seven axes of closed loop motion-, IO- and vision control
• X- and Y axes linear motors
• Z-, Theta-, VisionX-, VisionY- and Vision Zoom axes motors
• Micro precision force sensor table for detecting forces at 0.1N

Digital FireWire vision system

• Multiple field of view vision system, supports part sizes 0.2 to 70mm
• Motorized zoom, position of the zoom is stored in the program
• Zoom in function for the alignment process
• Up- and down looking illumination