The Vitronics Soltec XPM² product platform is the latest evolution in a long history of reflow systems that have proven their capability worldwide and established a reputation for superior reliability. Robust design combined with a unique heat transfer system consistently deliver benchmark thermal performance and precise process control for high production, 24 hours-a-day, 7 days-a-week environments. The XPM² is designed to handle new and stringent process requirements like Lead Free soldering for SMT and Semiconductor Packaging.

Features/Constraints:

• Top and Bottom Convection Heating and Cooling
• 8 Zones Heat - 2 Zones Cool 
• 350°C Max. Operating Temperature for Lead-Free Processing
• Nitrogen Capable
• Temperature Profile Capability 
• Belt (20" Max.) and Rail (18" Max.) Width
• Above Board Clearance = 1.5"
• Below Rail Clearance = .88"