Description

The KY-8030 is an in-line, fully automated Solder Paste Inspection (SPI) system that uses patented Koh Young shadow-free inspection technology and software to deliver 100% 3D inspection of solder paste. 

With industry studies over the past two years showing that approximately 50% of all electronics assembly errors and 65% of SMT-only defects are related to solder paste printing and solder joint formation, automated solder paste inspection immediately after screen-printing offers increased yields, and minimizes rework and retest, to reduce overall scrap costs and deliver more consistent product faster. 

Equipment Features and Constraints

Mechanical Limits

• Maximum PCB Size: 330 x 250 mm (12.99 x 9.84 in)
• Minimum PCB Size: 50 x 50 mm (1.97 x 1.97 in)
• PCB Thickness: 0.4 ~ 4.0 mm (0.016 ~ 0.16 in)
• Maximum PCB Weight: 1.0 kg (2.2 lbs)
• Bottom Side Clearance: 25.4 mm (1.0 in)

Inspection Range

• Metrology Capability: Volume, Area, Height, Offset, Bridging and Shape
• Types of Defects: Deformity, Insufficient/Excessive/Missing Paste, Bridging, Shape Deformity and Paste Offset

Camera Technology

• Camera: 2MPix
• Measurement Principle: 3D Shadow Free Moiré
• XY Pixel Resolution: 20 µm (0.79 mils)
• Z Resolution: 0.37 µm (0.015 mils)

Inspection Performance

• Inspection Speed at 20 µm:
  • Shadow Free Mode: 15.0 cm2/sec (2.33 sq. inch/sec)
  • High Speed Mode: 19.7 cm2/sec (3.05 sq. inch/sec)
• Volume Repeatability (on a KY Calibration Target): < 1% at 3 σ
• Volume Repeatability (on a PCB): < 1% at 3 σ
• Height Accuracy (on a KY Calibration Target): 2 µm
• Gage R&R (± 50 tolerance): << 10 % at 6 σ
• Max. PCB Warp Compensation: ± 3.5 mm (0.14 inch)
• Max. Paste Height: 400 µm (15.75 mils)
• Min. Paste Deposit Size at 20 µm:
  • Rectangle: 150 µm (5.91 mils)
  • Circle: 200 µm (7.87 mils)
• Min. Distance between Paste Deposit: 100 µm, at 150 µm paste height (3.94 mils, at 5.91 mils paste height)

PCB Handling

• Conveyor Width Adjustment: Automatic
• Conveyor Fix Type: Front/Rear Fixed (Factory Setting)
• Conveyor Height: 970 ~ 870 mm (38.19 ~ 34.25 inch)

S/W

• Statistical Analysis Tool: SPC Plus
• Inspection Program Generation: Import GERBER Data (274X, 274D)
• Options:
  • Zoom Head (15, 20, 30 µm Autozoom),
  • Off-line SPC & Defect Review Station,
  • Off-line Programming Station,
  • ODB++ File Conversion,
  • Barcode Reader (1D/2D),
  • HDD Raid 1 (Mirrored),
  • Certified Calibration Target,
  • UP