SenDEC's MIRTEC MV-7 series in-line AOI systems are designed to automatically inspect for manufacturing defects both pre and post reflow.  These systems offer superior fault coverage and can automatically inspect circuit boards optically in seconds for component presence/absence, polarity, value, misalignment, insufficient solder, solder bridging, lifted leads, etc.

Features/Constraints:

PCB Size

• 50 x 50mm (2.0" x 2.0") Min.

• 660 x 510mm (25.9" x 20.1") Max.

Top Side Component Clearance

• 45mm (1.77")

Bottom Side component Clearance

• 50.8mm (2.0") from bottom of PWB surface

Top-Down View Camera System:

• 5M pixel (2,456 x 2,058) resolution color camera
• 2D and 3D bar code recognition

Side View Camera System:

• Four-5M pixel (2,592 x 1,954) resolution color cameras

Intelli-Scan Laser System

• Lifted lead detection for gull-wing components and z-height measurement/coplanarity verification of BGAs

• 1μm resolution per point, at an inspection speed of 0.5 seconds per point

Minimum Component Inspection

• 01005 chip component

Inspection Speed

• 0.28 sec/ frame - 5,968 mm² / sec (9.250in² / sec)

Positioning System

• Closed-loop AC servo drive system

Positioning Resolution

• 6 μm

Positioning Repeatability

• ±15 μm