Panasonic CM402A High Speed Machines Print E-mail

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Machine Capabilities & Features

 

 

Board Sizes

Min = 50mm x 50mm (2.0" x 2.0")
Max = 510mm x 460mm (20.0" x 18.0")

Board Thickness

Min = .3mm (.01")
Max = 4.0mm (.157")

Edge Clearance

5mm (parts should be a min of 10mm from board edge to ensure no damage occurs)

Placement Accuracy

± 0.05mm Cpk >= 1 (.0019")

Placement Speed

.06 seconds/chip or 60,000 components per hour

Board Exchange Time

1.8 seconds

Component Range

Min = 0201
Max = 24mm x 24mm

Component Types

0201 > Chip Type
SOICs
PLCCs
QFPs

  • Min Lead Width = 1mm (.04")
  • Min Lead Pitch = .65mm (.025")

BGAs & CSPs

  • Min Bump Diameter = .5mm (.018")
  • Min Pitch = 1.0mm (.04")

Connectors

Placement Angles

0-359° in .01° increments

Supply Types

Tape (8mm wide to 56mm wide)

  • Provided the supplied part is less than 24mm x 24mm

# of Feeders Accepted

8mm

Max. 216 inputs (double tape feeders, small reels)

8mm

Max. 108 inputs (double tape feeders, large reels)

12/16mm

Max.108 inputs

24/32mm

Max. 52 inputs

44/56mm

Max. 36 inputs

Board Fiducial Recognition

 

Removable Feeder Carts

Feeder can be setup offline and loaded on the carts to reduce change over time

CVT

Verification and Traceability; on-board barcode scanners to verify feeder setup and track the time and date the component was changed

Splice Detection

Feeders can be changed while running to reduce downtime. The feeders can detect the splice adapter and date/time stamp the component change

 

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Perspectives

"I am extremely impressed with SenDEC. We had quotes out there to 3 or 4 different vendors; SenDEC was the only one who submitted their quote and delivered prototypes before we even received any other quotes. We asked our other vendors to not even bother. Everyone at SRC is extremely pleased with SenDEC's delivery, quality and performance on the project. I truly appreciate all the efforts that they have made."

Mike Ernenwein
Senior Engineer, Syracuse Research Corp

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