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Panasonic CM402A High Speed Machines |
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Machine Capabilities & Features
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Board Sizes
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Min = 50mm x 50mm (2.0" x 2.0") Max = 510mm x 460mm (20.0" x 18.0")
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Board Thickness
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Min = .3mm (.01") Max = 4.0mm (.157")
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Edge Clearance
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5mm (parts should be a min of 10mm from board edge to ensure no damage occurs)
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Placement Accuracy
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± 0.05mm Cpk >= 1 (.0019")
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Placement Speed
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.06 seconds/chip or 60,000 components per hour
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Board Exchange Time
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1.8 seconds
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Component Range
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Min = 0201 Max = 24mm x 24mm
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Component Types
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0201 > Chip Type SOICs PLCCs QFPs
- Min Lead Width = 1mm (.04")
- Min Lead Pitch = .65mm (.025")
BGAs & CSPs
- Min Bump Diameter = .5mm (.018")
- Min Pitch = 1.0mm (.04")
Connectors
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Placement Angles
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0-359° in .01° increments
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Supply Types
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Tape (8mm wide to 56mm wide)
- Provided the supplied part is less than 24mm x 24mm
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# of Feeders Accepted
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8mm
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Max. 216 inputs (double tape feeders, small reels)
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8mm
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Max. 108 inputs (double tape feeders, large reels)
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12/16mm
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Max.108 inputs
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24/32mm
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Max. 52 inputs
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44/56mm
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Max. 36 inputs
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Board Fiducial Recognition
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Removable Feeder Carts
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Feeder can be setup offline and loaded on the carts to reduce change over time
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CVT
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Verification and Traceability; on-board barcode scanners to verify feeder setup and track the time and date the component was changed
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Splice Detection
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Feeders can be changed while running to reduce downtime. The feeders can detect the splice adapter and date/time stamp the component change
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Perspectives
"I am extremely impressed with SenDEC. We had quotes out there to 3 or 4 different vendors; SenDEC was the only one who submitted their quote and delivered prototypes before we even received any other quotes. We asked our other vendors to not even bother. Everyone at SRC is extremely pleased with SenDEC's delivery, quality and performance on the project. I truly appreciate all the efforts that they have made."
Mike Ernenwein Senior Engineer, Syracuse Research Corp
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