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my100sx

Machine Capabilities & Features

Board sizes: Minimum:
70mm x 50mm (2.7” x 2.0”)
Maximum: 508mm x 442mm ( 20.0” x 17.4”)
Board Thickness: Minimum:
.8mm (31.5 mil)
Maximum: 12.5mm (492 mil) – can be thicker with tooling
Edge Clearance:
3.2mm (0.13”)
Top Side Clearance:
15mm (0.59")
Bottom Side Clearance:
32mm (1.25")
Maximum Board Weight:
15kg (33 lbs)
Placement Accuracy: Chip: ± 95μm (3.7 mil), 2.6°, Cpk = 1.33
Fine Pitch: ± 35μm (1.4 mil), 0.09°, Cpk = 1.33
Rated Placement Speed: Chip:
0.1674 seconds/chip (21,500 components per hour)
Fine Pitch: 1.125 seconds/(3,200 components per hour)
Board Exchange Time: Operator dependant (Manual Exchange)
Component Range: Minimum: 01005 components - 0.4 x 0.2mm (0.016" x 0.008")
Maximum: 56mm x 56mm x 15mm (2.20” x 2.20” x 0.59”)
Component Types: 01005 and greater (chip-type)
SOICs
PLCCs
QFPs Minimum Lead Width = .05mm (.002”), Minimum Lead Pitch = .10mm (.004”)
BGAs & CSPs Minimum Bump Diameter = .08mm (.003”), Minimum Pitch  = .16mm ( .006”)
Placement Angles: 0-359° in .01° increments
Supply Types: Tape from 8mm wide to 32mm wide
Number of feeders accepted: All limits are at initial startup. Additional magazines can be inserted on-the-fly as originals are depleted.
8mm Maximum 144 inputs
Vision Capability
(Dual Vision System):

Leaded Components:
Active Field of View: 15 x 15mm (0.59" x 0.59")
Min Pitch:  0.1mm (4 mil)
Min Lead Width: 0.05mm (2 mil)
Bumped Components:
Active Field of View: 15 x 15mm (0.59" x 0.59")
Min Pitch: 0.16mm (6.3 mil)
Min Lead Width: 0.08mm (3.1 mil)
Vision Capability
(Linescan Vision System):

Leaded Components:
Active Field of View: 56 x 56mm (2.2" x 2.2")
Min Pitch: 0.20mm (8 mil)
Min Lead Width: 0.10mm (4 mil)
Bumped Components:
Active Field of View: 56 x 56mm (2.2" x 2.2")
Min Pitch: 0.30mm (12 mil)
Min Lead Width: 0.15mm (6 mil)
Board Fiducial Recognition
Removable Magazines: Feeders can be setup off line and loaded on the magazines to reduce change over time
On-the-fly part placement order optimization
On-the-fly feeder loading: Feeders set up offline can be inserted while the machine is running













 

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Perspectives

"SenDEC is receiving this award (2006 Vision of Excellence Supplier Award) in recognition of their customer service, commitment to quality and partnership SenDEC and Hand Held Products have formed over the past six years. We acknowledge and reward SenDEC for its efforts in helping us to be successful."

Kevin Jost
President and CEO, Hand Held Products, Inc.

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