MIRTEC MV-7 Series Automated Optical Inspection (AOI) Systems Print E-mail

mirtec_mv7u_aoi_system 

SenDEC's MIRTEC MV-7 series in-line AOI systems are designed to automatically inspect for manufacturing defects both pre and post reflow.  These systems offer superior fault coverage and can automatically inspect circuit boards optically in seconds for component presence/absence, polarity, value, misalignment, insufficient solder, solder bridging, lifted leads, etc.

 

Features/Constraints:

PCB Size

  • 50 x 50mm (2.0" x 2.0") Min.
  • 660 x 510mm (25.9" x 20.1") Max.

Top Side Component Clearance

  • 45mm (1.77")

Bottom Side component Clearance

  • 50.8mm (2.0") from bottom of PWB surface

Top-Down View Camera System:

  • 5M pixel (2,456 x 2,058) resolution color camera
  • 2D and 3D bar code recognition

Side View Camera System:

  • Four-5M pixel (2,592 x 1,954) resolution color cameras

Intelli-Scan Laser System

  • Lifted lead detection for gull-wing components and z-height measurement/coplanarity verification of BGAs

  • 1μm resolution per point, at an inspection speed of 0.5 seconds per point

Minimum Component Inspection

  • 01005 chip component

Inspection Speed

  • 0.28 sec/ frame - 5,968 mm2 / sec (9.250in2 / sec)

Positioning System

  • Closed-loop AC servo drive system

Positioning Resolution

  • 6 μm

Positioning Repeatability

  • ±15 μm
 

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Perspectives

"The Vision of Excellence Supplier Award is presented to the supplier that demonstrates continuous quality improvement and provides Hand Held Products with rapid customer service, timely root cause and corrective action responses and institutes long term preventative actions to build quality into its products or services. A supplier that makes an impact on the quality of products and services provided by Hand Held Products to its customers."

2006 VOE Supplier Award
Presented to SenDEC by Hand Held Products, Inc., September 26, 2006

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