SenDEC's MRTEC MV-2HTX AOI Systems are designed to automatically inspect for manufacturing defects both pre and post reflow.  These systems offer superior fault coverage and can automatically inspect circuit boards optically in seconds for component presence/absence, polarity, value, misalignment, insufficient solder, solder bridging, etc.

Features/Constraints:

PCB Size

• 10 x 41mm (0.41" x 1.6") Min.
• 530 x 460mm (20.8" x 18.1") Max.

Top Side Component Clearance

• 45mm (1.77")

Bottom Side component Clearance

• 50.8mm (2.0") from bottom of PWB surface

Minimum Component Absence/Presence

• 01005 chip component

Minimum Component Optical Character Recognition (OCR) Inspection

• 0603 chip component

Inspection Speed

• 0.16 sec/ frame

Fiducial Mark Recognition Time

• 1.5 sec/ 2 point

Positioning System

• 2 Phase Micro Stepper

Resolution

• 6 μm

Repeatability

• ± 15 μm

Maximum Speed

• 700mm/sec