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Vitronics XPM2 820 Reflow Oven |
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The Vitronics Soltec XPM² product platform is the latest evolution in a long history of reflow systems that have proven their capability worldwide and established a reputation for superior reliability. Robust design combined with a unique heat transfer system consistently deliver benchmark thermal performance and precise process control for high production, 24 hours-a-day, 7 days-a-week environments. The XPM² is designed to handle new and stringent process requirements like Lead Free soldering for SMT and Semiconductor Packaging.
Features/Constraints:
- Top and Bottom Convection Heating and Cooling
- 8 Zones Heat - 2 Zones Cool
- 350°C Max. Operating Temperature for Lead-Free Processing
- Nitrogen Capable
- Temperature Profile Capability
- Belt (20" Max.) and Rail (18" Max.) Width
- Above Board Clearance = 1.5"
- Below Rail Clearance = .88"
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Perspectives
“SenDEC's team, from upper management to floor personnel, is extremely dedicated and committed to meeting the needs of their customers, specifically Telephonics. SenDEC's employees go above and beyond the call of duty, often times performing multiple job functions and working additional hours to meet and exceed their goals.” Douglas Giovan Engineering Analyst, Telephonics Corporation
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