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Vitronics XPM2 820 Reflow Oven |
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The Vitronics Soltec XPM² product platform is the latest evolution in a long history of reflow systems that have proven their capability worldwide and established a reputation for superior reliability. Robust design combined with a unique heat transfer system consistently deliver benchmark thermal performance and precise process control for high production, 24 hours-a-day, 7 days-a-week environments. The XPM² is designed to handle new and stringent process requirements like Lead Free soldering for SMT and Semiconductor Packaging.
Features/Constraints:
- Top and Bottom Convection Heating and Cooling
- 8 Zones Heat - 2 Zones Cool
- 350°C Max. Operating Temperature for Lead-Free Processing
- Nitrogen Capable
- Temperature Profile Capability
- Belt (20" Max.) and Rail (18" Max.) Width
- Above Board Clearance = 1.5"
- Below Rail Clearance = .88"
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Perspectives
“I am extremely impressed with SenDEC. We had quotes out there to 3 or 4 different vendors; SenDEC was the only one who submitted their quote and delivered prototypes before we even received any other quotes. We asked our other vendors to not even bother. Everyone at SRC is extremely pleased with SenDEC's delivery, quality and performance on the project. I truly appreciate all the efforts that they have made.” Mike Ernenwein Senior Engineer, Syracuse Research Corp
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