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Vitronics XPM2 820 Reflow Oven |
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The Vitronics Soltec XPM² product platform is the latest evolution in a long history of reflow systems that have proven their capability worldwide and established a reputation for superior reliability. Robust design combined with a unique heat transfer system consistently deliver benchmark thermal performance and precise process control for high production, 24 hours-a-day, 7 days-a-week environments. The XPM² is designed to handle new and stringent process requirements like Lead Free soldering for SMT and Semiconductor Packaging.
Features/Constraints:
- Top and Bottom Convection Heating and Cooling
- 8 Zones Heat - 2 Zones Cool
- 350°C Max. Operating Temperature for Lead-Free Processing
- Nitrogen Capable
- Temperature Profile Capability
- Belt (20" Max.) and Rail (18" Max.) Width
- Above Board Clearance = 1.5"
- Below Rail Clearance = .88"
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Perspectives
“The Vision of Excellence Supplier Award is presented to the supplier that demonstrates continuous quality improvement and provides Hand Held Products with rapid customer service, timely root cause and corrective action responses and institutes long term preventative actions to build quality into its products or services. A supplier that makes an impact on the quality of products and services provided by Hand Held Products to its customers.” 2006 VOE Supplier Award Presented to SenDEC by Hand Held Products, Inc., September 26, 2006
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