SenDEC offers a wide range of services for PCB manufacturing, subassembly, electromechanical assembly, final product assembly (box build) and full turnkey production. Whether your board is simple or complex, and no matter what quantity you need, you get the same high quality, quick time-to-market service that has made SenDEC one of the fastest growing companies in the nation.

PCB Manufacturing Services at a Glance

We provide personalized service, quality processes, and comprehensive manufacturing capabilities, including:

• High Speed SMT Board Assembly, Single and Double Sided
• Fine Pitch 0201 Component Placement
• BGA & Micro BGA (Ball Grid Array)
• RoHS Compliant Assembly
• Mixed Technologies (Through-Hole and SMT)
• PCB Subassembly
• Electromechanical Assembly
• Final Product Assembly (Box Build)
• 100% Material Procurement, 100% Consigned Material Management, or a Mix of Both 
• Project Management
• Value Added Services

Our manufacturing process includes initial design and in-process quality inspections throughout.  Your product is produced at the lowest possible cost without compromising on quality.

The Benefits To You

SenDEC has over 30 years of electronics manufacturing expertise that will be applied to your project as our customer including:

• SenDEC Customer Service 
• SenDEC Quality Processes
• Precision Placement
• Faster Throughput
• Lower Costs Through Automation
• SenDEC Component Expertise and Procurement Leverage
• Feedback On Cost Reduction Opportunities

Value Added Services

In addition to our core advantages, SenDEC offers a variety of value-added services to meet your special requirements or product applications.

Automatic Optical Inspection (AOI)

Our AOI stations offer superior fault coverage and are able to inspect all components optically for placement (absence and presence), value, orientation, type, color differences, soldering, short circuits, and dry joints.  This is the most cost effective way for SenDEC to inspect all populated printed circuit boards. 

X-Ray Inspection

SenDEC uses a state-of-the-art x-ray system to provide the highest level of quality inspection for process and board analysis.  While X-ray inspection is essential for verifying the quality of BGA (Ball Grid Array) components, it is also useful for analysis of standard IC packages and connectors.  With x-ray inspection, our engineers can look through the board and components associated with hidden failures to identify and solve problems that would be impossible to find through visual inspection alone.  In many cases we're able to remove defects during the manufacturing process and avoid the expensive performance problems that they might cause.  We save all our x-ray inspection images in digital form for future references and to verify manufacturability.

Testing

SenDEC's offers in-circuit and functional testing of electronic assemblies. Our Test Engineering Department is staffed by electrical engineers and technicians with years of experience building test equipment and developing effective test methodologies. We can utilize your existing test fixtures or design them ourselves. Either way, we will make sure that your finished product will meet or exceed your quality and performance requirements.

Programming of Components

SenDEC's Engineering Department is capable of programming a wide variety of devices, including:

Design For Manufacturability / Design For Assembly / Design For Test Evaluation

This is one of SenDEC's key value added services to our customers. SenDEC design engineers are experts in designing products that perform well and can be produced cost-effectively.  Our engineers can provide a thorough DFM/DFA/DFT evaluation of your existing design and recommend any modifications that will deliver the performance you require at the lowest possible production cost to you. If a new design is needed, our engineers can work with you to build your product from concept to completion, incorporating DFM/DFA/DFT principles throughout.

Standards Conformance

We will test your product to certify that it meets UL safety standards as well as conforms to the appropriate IPC workmanship standards (Class II or Class III).  SenDEC also offers RoHS design and manufacturing services.

Want to learn more about SenDEC PCB manufacturing services? Call us toll free at 1-800-295-8000 and ask for Sales or submit a request here.