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Universal GSM 1 Flexible Placement Systems with Tray Towers |
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Machine Capabilities & Features
| Board Sizes |
Min = 50mm x 50mm (2.0" x 2.0")
Max = 635mm x 508mm (25.0" x 20.0") |
| Board Thickness |
Min = .5mm (.02")
Max = 5.0mm (.20") |
| Edge Clearance |
5mm (parts should be a min of 10mm from board edge to ensure no damage occurs) |
| Placement Accuracy |
± 0.62µm (microns) Cpk >= 1.33 |
| Placement Speed |
.36 seconds/chip or 10,000 components per hour |
| Component Range |
Min = 0402
Max = 50mm x 50mm |
| Component Types |
0402 > Chip Type
SOICs
PLCCs
QFPs
- Min Lead Width = 16mm (.0065")
- Min Lead Pitch = .25mm (.010")
BGAs & CSPs
- Min Bump Diameter = .25mm (.010")
- Min Pitch = .53mm (.021")
Connectors |
| Placement Angles |
0-359° in .01° increments |
| Supply Types |
Tape (8mm wide to 120mm wide)
Tubes
Trays
Bulk |
| # of Feeders Accepted |
| 8/12mm |
Max. 72 inputs |
| 16/24/32mm |
Max.36 inputs |
| 44mm |
Max. 24 inputs |
| 56mm |
Max. 18 inputs |
| 72mm |
Max. 14 inputs |
| 88/104mm |
Max. 12 inputs |
| 120mm |
Max. 10 inputs |
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| High Force Capability: |
2500 grams - through hole or snap fit components
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| Cameras: |
2.6mil per pixel
4.0mil per pixel |
| Tray Tower |
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| Odd Form Component Placement |
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| Board Fiducial Recognition |
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Perspectives
“The quality and workmanship is exceptional. SenDEC engineers suggested alternative manufacturing methods that have helped us reduce the cost of our printed circuit boards. SenDEC's customer service is extremely cooperative and responsive. Even when we ‘need it yesterday’, SenDEC bends over backwards to deliver in time.” Jim Childs Purchasing Agent, Pulsafeeder, Inc.
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