|
Universal GSM 1 Flexible Placement Systems with Tray Towers |
|
|
Machine Capabilities & Features
| Board Sizes |
Min = 50mm x 50mm (2.0" x 2.0")
Max = 635mm x 508mm (25.0" x 20.0") |
| Board Thickness |
Min = .5mm (.02")
Max = 5.0mm (.20") |
| Edge Clearance |
5mm (parts should be a min of 10mm from board edge to ensure no damage occurs) |
| Placement Accuracy |
± 0.62µm (microns) Cpk >= 1.33 |
| Placement Speed |
.36 seconds/chip or 10,000 components per hour |
| Component Range |
Min = 0402
Max = 50mm x 50mm |
| Component Types |
0402 > Chip Type
SOICs
PLCCs
QFPs
- Min Lead Width = 16mm (.0065")
- Min Lead Pitch = .25mm (.010")
BGAs & CSPs
- Min Bump Diameter = .25mm (.010")
- Min Pitch = .53mm (.021")
Connectors |
| Placement Angles |
0-359° in .01° increments |
| Supply Types |
Tape (8mm wide to 120mm wide)
Tubes
Trays
Bulk |
| # of Feeders Accepted |
| 8/12mm |
Max. 72 inputs |
| 16/24/32mm |
Max.36 inputs |
| 44mm |
Max. 24 inputs |
| 56mm |
Max. 18 inputs |
| 72mm |
Max. 14 inputs |
| 88/104mm |
Max. 12 inputs |
| 120mm |
Max. 10 inputs |
|
| High Force Capability: |
2500 grams - through hole or snap fit components
|
| Cameras: |
2.6mil per pixel
4.0mil per pixel |
| Tray Tower |
|
| Odd Form Component Placement |
|
| Board Fiducial Recognition |
|
|
|
Perspectives
“When we need an order ASAP, they always come through. Their customer service is excellent. I wish all my vendors could copy their performance!” Rose Ann Bensley Senior Buyer, BMP America, Inc.
|
.jpg)
