Panasonic CM402C High Speed & Flexible Placement System With Tray Tower E-mail

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Machine Capabilities & Features

Board Sizes Min = 50mm x 50mm (2.0" x 2.0")
Max = 510mm x 460mm (20.0" x 18.0")
Board Thickness Min = .3mm (.01")
Max = 4.0mm (.157")
Edge Clearance 5mm (parts should be a min of 10mm from board edge to ensure no damage occurs)
Placement Accuracy ± 0.035mm Cpk >= 1 (.0013")
Placement Speed .18 seconds/chip or 20,000 components per hour
Board Exchange Time 1.8 seconds
Component Range Min = 0201
Max = 100mm x 90mm
Component Types 0201 > Chip Type
SOICs
PLCCs
QFPs
  • Min Lead Width = 1mm (.04")
  • Min Lead Pitch = .65mm (.025")
BGAs & CSPs
  • Min Bump Diameter = .5mm (.018")
  • Min Pitch = 1.0mm (.04")
Connectors
Placement Angles 0-359° in .01° increments
Supply Types Tape (8mm wide to 56mm wide)
  • Provided the supplied part is less than 24mm x 24mm

Tubes
Trays
# of Feeders Accepted
8mm Max. 204 inputs (double tape feeders, small reels)
8mm Max. 102 inputs (double tape feeders, large reels)
12/16mm Max.102 inputs
24/32mm Max. 49 inputs
44/56mm Max. 33 inputs
Board Fiducial Recognition  
Removable Feeder Carts Feeder can be setup offline and loaded on the carts to reduce change over time
CVT Verification and Traceability; on-board barcode scanners to verify feeder setup and track the time and date the component was changed
Splice Detection Feeders can be changed while running to reduce downtime. The feeders can detect the splice adapter and date/time stamp the component change
 

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Perspectives

I just wanted to thank you for your help with the MEADS Program CCA. Working with SenDEC was a pleasure and we have been very satisfied with all of your efforts. I felt that your teams went above and beyond the normal call of duty in support of our design. I look forward to working with you again in the near future. Thanks again!

Russ Trask
Design Manager, Lockheed Martin Corporation
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