Panasonic CM402A High Speed Machines E-mail

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Machine Capabilities & Features

 

Board Sizes

Min = 50mm x 50mm (2.0" x 2.0")
Max = 510mm x 460mm (20.0" x 18.0")

Board Thickness

Min = .3mm (.01")
Max = 4.0mm (.157")

Edge Clearance

5mm (parts should be a min of 10mm from board edge to ensure no damage occurs)

Placement Accuracy

± 0.05mm Cpk >= 1 (.0019")

Placement Speed

.06 seconds/chip or 60,000 components per hour

Board Exchange Time

1.8 seconds

Component Range

Min = 0201
Max = 24mm x 24mm

Component Types

0201 > Chip Type
SOICs
PLCCs
QFPs

  • Min Lead Width = 1mm (.04")
  • Min Lead Pitch = .65mm (.025")

BGAs & CSPs

  • Min Bump Diameter = .5mm (.018")
  • Min Pitch = 1.0mm (.04")

Connectors

Placement Angles

0-359° in .01° increments

Supply Types

Tape (8mm wide to 56mm wide)

  • Provided the supplied part is less than 24mm x 24mm

# of Feeders Accepted

8mm

Max. 216 inputs (double tape feeders, small reels)

8mm

Max. 108 inputs (double tape feeders, large reels)

12/16mm

Max.108 inputs

24/32mm

Max. 52 inputs

44/56mm

Max. 36 inputs

Board Fiducial Recognition

 

Removable Feeder Carts

Feeder can be setup offline and loaded on the carts to reduce change over time

CVT

Verification and Traceability; on-board barcode scanners to verify feeder setup and track the time and date the component was changed

Splice Detection

Feeders can be changed while running to reduce downtime. The feeders can detect the splice adapter and date/time stamp the component change

 

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Perspectives

SenDEC is receiving this award (2006 Vision of Excellence Supplier Award) in recognition of their customer service, commitment to quality and partnership SenDEC and Hand Held Products have formed over the past six years. We acknowledge and reward SenDEC for its efforts in helping us to be successful.

Kevin Jost
President and CEO, Hand Held Products, Inc.
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