Industry Magazines
Magazines with editorial content related to the electronics design and manufacturing sector.
  Web Link
  Link   SMT Magazine
SMT, the magazine for electronics assembly, is the only industry publication whose editorial is devoted exclusively to surface mount assembly of printed circuit boards.
  Link   EMS007
EMS007 is the leading real-time, online magazine for the global Electronics Manufacturing Services industry. EMS007 is the most comprehensive news source for industry professionals working in the Global Electronics Manufacturing Services industry.
  Link   Circuits Assembly
The journal for surface mount and electronics assembly.
  Link   Design-2-Part Magazine
Design-2-Part (D2P) magazine publishes articles of interest to outsourcing decision-makers, who are the customers and potential customers of North American job shops. Readers of the publication include manufacturing engineers, manufacturing managers,
  Link   EDN - Electronics Design, Strategy, News
EDN.com, the Internet home of Electronic News, EDN, and Electronic Business, delivers a three-dimensional view of the electronics industry via breaking news coverage, strategic business information, and in-depth technical engineering content.
  Link   EETimes.com
EE Times' editorial mission is to provide engineers and technical managers with timely, relevant news, analysis and opinion - of both technology and business - to help them keep their fingers on the pulse of the industry and to enable them to make th
  Link   Manufacturing Today
Manufacturing Today monitors the fast-changing marketplace for manufactured goods in North American companies and analyzes effective strategies of the most successful firms.
 

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Perspectives

I am extremely impressed with SenDEC. We had quotes out there to 3 or 4 different vendors; SenDEC was the only one who submitted their quote and delivered prototypes before we even received any other quotes. We asked our other vendors to not even bother. Everyone at SRC is extremely pleased with SenDEC's delivery, quality and performance on the project. I truly appreciate all the efforts that they have made.

Mike Ernenwein
Senior Engineer, Syracuse Research Corp
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